Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology
US6428673B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2000 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Jul 8, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electrochemical processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. An electrochemical deposition unit provides a space to receive said microelectronic workpiece to deposit a subsequent film layer onto a prior layer, wherein a condition signal from the metrology unit influences the process control of the electrochemical deposition unit. The signal can also be used to transfer the microelectronic workpiece to a layer stripping unit, or a layer enhancement unit, or to a non-compliance station. The apparatus is particularly useful in measuring seed layer thickness and adjusting the operating control of a computational fluid dynamic reactor, which electroplates a process layer onto the seed layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.