Polishing apparatus and method for forming an integrated circuit
US6443809B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 1999 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Nov 16, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D7/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In one embodiment, a semiconductor substrate (38) is uniformly polished using a polishing pad (16) that has a first polishing region (26), a second polishing region (28), and a third polishing region (30). The semiconductor substrate (38) is aligned to the polishing pad (16), such that the center of the semiconductor substrate (38) overlies the second polishing region (28), and the edge of the semiconductor substrate overlies the first polishing region (26) and the third polishing region (30). During polishing, the semiconductor substrate (38) is not radially oscillated over the surface of the polishing pad, and as a result a more uniform polishing rate is achieved across the semiconductor substrate (38). This allows the semiconductor substrate (38) to be uniformly polished from center to edge, and increases die yield because die located on the semiconductor substrate (38) are not over polished.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.