Micro-flex technology in semiconductor packages
US6444490B1 · kind B1 · utility
42Cited by
15References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2001 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Jun 28, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0228
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Thin-film microflex twisted-wire pair and other connectors are disclosed. Semiconductor packages include microflex technology that electrically connects at least one chip to another level of packaging. Microflex connectors, such as thin-film twisted-wire pair connectors according to the present invention provide superior electrical performance, which includes reduced line inductance, incorporation of integrated passive components, and attachment of discrete passive and active components to the microflex. All of these features enable operation of the chip at increased frequencies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.