Semi-insulating diffusion barrier for low-resistivity gate conductors
US6444516B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2000 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Sep 25, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/664
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A gate structure for a semiconductor device, and particularly a MOSFET for such applications as CMOS technology. The gate structure entails an electrical insulating layer on a semiconductor substrate, over which a polysilicon gate electrode is formed. The gate structure further includes a gate conductor that is electrically connected with the gate electrode through a diffusion barrier layer having semi-insulating properties. The composition and thickness of the diffusion barrier layer are tailored so that the barrier layer is effective to block diffusion and intermixing between the gate conductor and polysilicon gate electrode, yet provides sufficient capacitive coupling and/or current leakage so as not to significantly increase the gate propagation delay of the gate structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.