Apparatus and methods for handling a substrate
US6454332B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 1998 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Dec 4, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Substrate handling apparatus and methods are described. In one aspect, the substrate handling apparatus includes a clamping member having an extended condition wherein substrate movement relative to the transfer arm is substantially restricted and a retracted condition wherein substrate movement relative to the transfer arm is substantially free. The substrate handling apparatus further includes a sense mechanism (e.g., a vacuum sensor) constructed to determine whether a substrate is properly positioned on the support arm and to trigger the mode of operation of the clamping member between extended and retracted conditions. The sense mechanism also provides information relating to the operating condition of the clamping member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.