Apparatus and method for electro chemical deposition
US6454927B1 · kind B1 · utility
13Cited by
5References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2000 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Jun 26, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electro-chemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.