Polishing apparatus and method with a refreshing polishing belt and loadable housing
US6468139B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2000 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Oct 6, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B47/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is directed to methods and apparatus for polishing a surface of a semiconductor wafer using a pad or belt moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad or belt provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad or belt as the pad or belt moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having novel wafer loading and unloading methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.