Apparatus and method for reducing redeposition in a physical vapor deposition system
US6468404B2 · kind B2 · utility
6Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2001 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Mar 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3402
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A PVD system comprises a hollow cathode magnetron with a capability of producing a high magnetic field for PVD and a low magnetic field for pasting. The high magnetic field is used for PVD and causes an optimal uniform film to form on a substrate but redeposits some metals onto a top portion of a target within the magnetron. The low magnetic field erodes redeposited materials from a top portion of a target within the magnetron.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.