Direct heatpipe attachment to die using center point loading
US6469893B1 · kind B1 · utility
23Cited by
3References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2000 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Sep 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus that includes a number of stacked computer components such as a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.