Sacrificial retaining ring CMP system and methods for implementing the same
US6471566B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2000 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Nov 8, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A retaining ring structure of a carrier head designed for use in a chemical mechanical polishing system (CMP) is provided. The retaining ring includes a retaining ring support and a sacrificial retaining ring, which is designed to confine a substrate to be polished. The included sacrificial retaining ring has an upper surface and a contact surface. The upper surface of the sacrificial retaining ring is configured to be attached to the retaining ring support, such that the retaining ring support holds the sacrificial retaining ring. Preferably, the contact surface of the sacrificial retaining ring is configured to be substantially planer with a top surface of the substrate being polished. In a preferred example, the sacrificial retaining ring can include a plurality of capillary tubes and is constructed from a material having substantially the same characteristics as the surface of the substrate to be polished.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.