Semiconductor module including a plurality of semiconductor devices detachably
US6472744B2 · kind B2 · utility
21Cited by
22References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 1998 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Jul 22, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.