Boat for organic and ceramic flip chip package assembly

US6488158B1 · kind B1 · utility

Assignee

• Advanced Micro Devices, Inc. · US

Inventors

• Mohammad Khan · San Jose, US
• Raj N. Master · San Jose, US
• Maria Guardado · San Jose, US
• Loo L. Teoh · Bukit Mertajam, MY
• Ahmad Juwanda · Bayan Lepas, MY

Key dates

• Filing date: Sep 11, 2000
• Grant date: Dec 3, 2002
• Expiry date: Nov 15, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2221/68313
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A boat is formed with a plurality of through-holes sized to securely maintain ceramic or organic flip chip semiconductor packages in place during assembly. Embodiments comprises a boat having a bottom layer with an array of four-sided through-holes and a top layer with an array of through-holes and tabs extending from the sides of the through-hole. Embodiments further include a boat having a bottom layer with through-holes smaller than substantially aligned overlying through-holes in the top layer, the substantially aligned through-holes forming flip chip package holding pockets. An alignment mechanism ensures that components are accurately positioned on flip chip packages held in the boat during assembly.