Semiconductor module package substrate fabrication method
US6494361B1 · kind B1 · utility
8Cited by
9References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2001 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Jan 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3485
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Organic solderability protectant (OSP) is applied to copper bond pads. The copper bond pads include flip chip bond pads and SMD bond pads on a dielectric upper surface and BGA bond pads on a dielectric lower surface. Solder paste is applied to the flip chip bond pads. This solder paste is reflowed in an inert atmosphere to form solder-on-pads (SOPs) on the flip chip bond pads. Flux residue from the solder paste is then removed with water. By reflowing the solder paste in an inert atmosphere and removing the flux residue with water, degradation of the OSP and oxidation of the SMD and BGA bond pads is inhibited.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.