Substrate support having bonded sections and method
US6503368B1 · kind B1 · utility
30Cited by
11References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2000 |
| Grant date | Jan 7, 2003 |
| Priority date | — |
| Expiry date | Jan 2, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate support 55 comprises first, second and third sections 88, 90, 92 connected to one another by first and second bonds 106, 108, one of the sections comprises a surface 75 adapted to receive a substrate 25. The first bond 106 comprises a first bonding material and the second bond 108 comprises a second bonding material. In one version, the first bonding material is capable of bonding surfaces when heated to a first temperature and the second bonding material is capable of bonding surfaces when heated to a second temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.