Compensation component and method for fabricating the compensation component
US6504230B2 · kind B2 · utility
35Cited by
5References
5Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 7, 2002 |
| Grant date | Jan 7, 2003 |
| Priority date | — |
| Expiry date | Mar 7, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/834
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A compensating component and a method for the production thereof are described. Compensating regions are produced by implanting sulfur or selenium in a p-conductive semiconductor layer or, are provided as p-conductive regions, which are doped with indium, thallium and/or palladium, in a cluster-like manner inside an n-conductive region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.