Patent · US Expired

Compensation component and method for fabricating the compensation component

US6504230B2 · kind B2 · utility

35Cited by
5References
5Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 7, 2002
Grant dateJan 7, 2003
Priority date
Expiry dateMar 7, 2022

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D62/834
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A compensating component and a method for the production thereof are described. Compensating regions are produced by implanting sulfur or selenium in a p-conductive semiconductor layer or, are provided as p-conductive regions, which are doped with indium, thallium and/or palladium, in a cluster-like manner inside an n-conductive region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.