Inductively coupled plasma source with controllable power deposition
US6507155B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2000 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | Apr 6, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/321
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Method and apparatus for distributing power from a single power source to a plurality of coils disposed on a processing chamber which provides controllable plasma uniformity across a substrate disposed in the processing chamber. The apparatus for distributing power from a power source to two or more coils disposed on a process chamber comprises a connection between the power source and a first coil, a series capacitor connected between the power source and the second coil, and a shunt capacitor connected to a node between the second coil and the power source. The method for distributing power from one power source to a plurality of coils comprises connecting a first coil between the power source and a ground connection, connecting a first power distribution network to the power source, wherein each power distribution network comprises a series capacitor and a shunt capacitor, and connecting a second coil between the first power distribution network and a ground connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.