Chip size image sensor in wirebond package with step-up ring for electrical contact
US6509560B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2000 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | Nov 13, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15151
Abstract
An image sensor package includes an image sensor having an upper surface. The image sensor further includes an active area and bond pads on the upper surface. A window is supported above the active area by a window support. A step up ring is mounted above a noncritical region of the upper surface of the image sensor between the active area and the bond pads. Electrically conductive traces on the step up ring are electrically connected to the bond pads by bond wires. An inner package body is formed between the step up ring and the window support and mechanically locks the window in place. An outer package body is formed to enclose the bond wires, the bond pads, and outer sides of the step up ring. The outer package body has outer sides coplanar with sides of the image sensor such that the image sensor assembly is chip size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.