Carrier head with local pressure control for a chemical mechanical polishing apparatus

US6511367B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Steven M. Zuniga · Soquel, US
• Hung Chih Chen · San Jose, US
• Manoocher Birang · Los Gatos, US
• Kapila Wijekoon · Santa Clara, US
• Sen-Hou Ko · Cupertino, US

Key dates

• Filing date: Jan 28, 2002
• Grant date: Jan 28, 2003
• Expiry date: Jan 28, 2022

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B49/16
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.