Heat sink grounded to a grounded package lid
US6512675B1 · kind B1 · utility
21Cited by
16References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2001 |
| Grant date | Jan 28, 2003 |
| Priority date | — |
| Expiry date | Mar 1, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An intregrated circuit package, which has an intregrated circuit die thereto, is mounted to a system board. The ground trace of the system board is connected to the package, which has a pluality of ground leads on its surface. An electrically conductive epoxy is placed on the ground leads and adheres the package lid to the package board and ground the package lid. A heat sink is mounted to the package lid with an electrically conductive adhesive or electrically conductive slips that extend from a flange of the package lid to a flange of the heat sink to ground the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.