Apparatus and methods for collecting global data during a reticle inspection
US6516085B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 1999 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | May 3, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of inspecting a reticle defining a circuit layer pattern that is used within a corresponding semiconductor process to generate corresponding patterns on a semiconductor wafer. A test image of the reticle is provided, and the test image has a plurality of test characteristic values. A baseline image containing an expected pattern of the test image is also provided. The baseline image has a plurality of baseline characteristic values that correspond to the test characteristic values. The test characteristic values are compared to the baseline characteristic values such that a plurality of difference values are calculated for each pair of test and baseline characteristic values. Statistical information is also collected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.