Temporary attach article and method for temporary attach of devices to a substrate
US6518674B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2001 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Mar 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A temporary attach article of a first component to a second component which includes a first component having a first volume of a fusible material; a second component having a second volume of fusible material; and the first and second components being joined together through the first and second volumes of fusible material, wherein the first volume of fusible material has a melting point higher than a melting point of the second volume of fusible material so that the first and second components may be joined together without melting of the first volume of fusible material and wherein the second volume of fusible material is 5 to 20% of the first volume of fusible material. Also disclosed is a method for temporary attach of devices to an electronic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.