Stacked structure of an image sensor and method for manufacturing the same
US6521881B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2001 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Apr 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
Abstract
A stacked structure of an image sensor includes a substrate, an integrated circuit, a package layer, an image sensing chip, and a transparent layer. The integrated circuit is formed on the substrate and electrically connected to the substrate. The package layer covers the integrated circuit. The image sensing chip is placed on the package layer to form the stacked structure with the integrated circuit and is electrically connected to the substrate. The transparent layer is arranged above the image sensing chip for the image sensing chip to receive image signals via the transparent layer. According to this structure, the image sensing chip and the integrated circuit can be integrally stacked easily.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.