Inventor · 東區, TW

Mon Ho

13Patents
7h-index
29Co-inventors
66Inventor score

Filing activity: Jan 23, 2001 → Nov 18, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US6559539B2 Stacked package structure of image sensor Electricity 26 Expired
US6521881B2 Stacked structure of an image sensor and method for manufacturing the same Electricity 24 Expired
US6627983B2 Stacked package structure of image sensor Electricity 24 Expired
US6590269B1 Package structure for a photosensitive chip Electricity 18 Expired
US7423334B2 Image sensor module with a protection layer and a method for manufacturing the same Electricity 10 Active
US6737720B2 Packaging structure of image sensor and method for packaging the same Electricity 10 Expired
US7554599B2 Image sensor module with air escape hole and a method for manufacturing the same Electricity 8 Active
US8093674B2 Manufacturing method for molding image sensor package structure and image sensor package structure thereof Electricity 4 Active
US6489572B2 Substrate structure for an integrated circuit package and method for manufacturing the same Emerging Cross-Sectional Technologies 4 Expired
US8847146B2 Image sensor package structure with casing including a vent without sealing and in communication with package material Electricity 3 Active
US6565008B2 Module card and a method for manufacturing the same Electricity 0 Expired
US11783621B2 Optical fingerprint imaging device Electricity 0 Active
US12048228B2 Image capture device Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.