Ball grid array semiconductor package with improved strength and electric performance and method for making the same
US6534852B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2000 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Apr 11, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are metal reinforced layers disposed at the upper and lower surfaces of the thin substrate to reinforce the strength of the thin substrate. With reinforced strength, the thin substrate is not susceptible to deform due to temperature fluctuation during packaging process, and thus the warpage for the semiconductor package is significantly eliminated. According to another aspect of the present invention, the metal reinforced layer at the lower surface of the thin substrate is functioned as a ground plane for the ball grid array (BGA) semiconductor package for better grounding effect. The present invention provides an optimal design for the return current path and impedance matching control. Besides, in high frequency application, the metal reinforced layer also can reduce the noise and cross talk among the signal lines of the ball grid array (BGA) semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.