Sockets for “springed” semiconductor devices
US6534856B1 · kind B1 · utility
91Cited by
41References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2001 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Mar 27, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53183
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.