Method and apparatus for transferring and supporting a substrate
US6537011B1 · kind B1 · utility
33Cited by
25References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2000 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | Jul 31, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for supporting and transferring a substrate in a semiconductor wafer processing system. In one aspect, a support ring having one or more substrate support members mounted thereon and defining a central opening therein for receipt of a substrate support member during processing is disclosed. In another aspect, a substrate handler blade having a plurality of substrate supports disposed thereon is provided which is adapted to support a substrate thereon and effectuate substrate transfer between the substrate handler blade and the support ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.