Module card and a method for manufacturing the same
US6565008B2 · kind B2 · utility
0Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2001 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Dec 4, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a module card comprises steps of: providing a base board having a golden finger; mounting a chip on the base board for electrically connecting to the golden finger; and forming a packing layer on the chip for forming the module card. A module card comprises: a base board; a chip mounting on a surface of the base board; a golden finger on the board and electrically connecting to the chip; and a packing layer forming on the chip for covering the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.