Allis Chen
4Patents
2h-index
20Co-inventors
37Inventor score
Filing activity: Jan 23, 2001 → Apr 1, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6590269B1 | Package structure for a photosensitive chip | Electricity | 18 | Expired |
| US6489572B2 | Substrate structure for an integrated circuit package and method for manufacturing the same | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6565008B2 | Module card and a method for manufacturing the same | Electricity | 0 | Expired |
| US6501187B1 | Semiconductor package structure having central leads and method for packaging the same | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.