Repair of resistive electrical connections in an integrated circuit
US6566888B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2001 |
| Grant date | May 20, 2003 |
| Priority date | — |
| Expiry date | Apr 11, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76894
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to the repair of resistive circuitry in an integrated circuit die having a multitude of circuit paths. According to an example embodiment of the present invention, a semiconductor die having a resistive electrical connection is analyzed. The location of a circuit portion in the die having a resistive electrical connection is identified. Using the identified location, the resistive circuit portion is annealed and the resistivity of that circuit portion is reduced. The reduced resistivity improves the ability of the die to operate at high speeds, and makes possible the repair and subsequent use of the die in various applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.