Membrane partition system for plating of wafers
US6569299B1 · kind B1 · utility
80Cited by
34References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 18, 2000 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | May 18, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/008
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An anode includes an anode cup, a membrane and ion source material, the anode cup and membrane forming an enclosure in which the ion source material is located. The anode cup includes a base section having a central aperture and the membrane also has a central aperture. A jet is passed through the central apertures of the base section of the anode cup and through the membrane allowing plating solution to be directed at the center of a wafer being electroplated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.