Additives to CMP slurry to polish dielectric films
US6569349B1 · kind B1 · utility
38Cited by
51References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2000 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Oct 23, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method and composition for planarizing a substrate. The composition includes one or more chelating agents, one or more oxidizers, one or more corrosion inhibitors, a polar solvent, and deionized water. The composition may further comprise one or more surfactants, one or more agents to adjust the pH and/or abrasive particles. The method comprises planarizing a substrate using a composition including a polar solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.