Fred C. Redeker
170Patents
33h-index
164Co-inventors
93Inventor score
Filing activity: Jan 8, 1992 → Sep 16, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6170428A | Symmetric tunable inductively coupled HDP-CVD reactor | Electricity | 322 | Expired |
| US6182602A | Inductively coupled HDP-CVD reactor | Electricity | 304 | Expired |
| US5944902A | Plasma source for HDP-CVD chamber | Electricity | 293 | Expired |
| US6083344A | Multi-zone RF inductively coupled source configuration | Electricity | 287 | Expired |
| US5865896A | High density plasma CVD reactor with combined inductive and capacitive coupling | Electricity | 245 | Expired |
| US6465051B1 | Method of operating high density plasma CVD reactor with combined inductive and capacitive coupling | Electricity | 191 | Expired |
| US5788799A | Apparatus and method for cleaning of semiconductor process chamber surfaces | Emerging Cross-Sectional Technologies | 184 | Expired |
| US6220201A | High density plasma CVD reactor with combined inductive and capacitive coupling | Electricity | 172 | Expired |
| US5761023A | Substrate support with pressure zones having reduced contact area and temperature feedback | Electricity | 122 | Expired |
| US6179709A | In-situ monitoring of linear substrate polishing operations | Electricity | 116 | Expired |
| US6988327B2 | Methods and systems for processing a substrate using a dynamic liquid meniscus | Emerging Cross-Sectional Technologies | 110 | Expired |
| US5772771A | Deposition chamber for improved deposition thickness uniformity | Electricity | 101 | Expired |
| US5984769A | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus | Performing Operations; Transporting | 99 | Expired |
| US6379223B1 | Method and apparatus for electrochemical-mechanical planarization | Performing Operations; Transporting | 97 | Expired |
| US6070551A | Deposition chamber and method for depositing low dielectric constant films | Electricity | 76 | Expired |
| US7191787B1 | Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid | Emerging Cross-Sectional Technologies | 75 | Expired |
| US6273806A | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus | Performing Operations; Transporting | 73 | Expired |
| US5292399A | Plasma etching apparatus with conductive means for inhibiting arcing | Emerging Cross-Sectional Technologies | 65 | Expired |
| US6537144B1 | Method and apparatus for enhanced CMP using metals having reductive properties | Electricity | 64 | Expired |
| US6602724B2 | Chemical mechanical polishing of a metal layer with polishing rate monitoring | Physics | 57 | Expired |
| US6833052B2 | Deposition chamber and method for depositing low dielectric constant films | Electricity | 56 | Expired |
| US6309276A | Endpoint monitoring with polishing rate change | Performing Operations; Transporting | 51 | Expired |
| US5748434A | Shield for an electrostatic chuck | Electricity | 50 | Expired |
| US6645061B1 | Polishing pad having a grooved pattern for use in chemical mechanical polishing | Performing Operations; Transporting | 49 | Expired |
| US6220942A | CMP platen with patterned surface | Performing Operations; Transporting | 47 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.