Method and apparatus for improved substrate handling
US6575737B1 · kind B1 · utility
33Cited by
15References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2000 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Oct 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A transfer chamber is provided. The transfer chamber has a temperature adjustment plate located in an upper portion of the chamber, a substrate handler located in a lower portion of the chamber, and a rotatable substrate carriage adapted so as to raise and lower between an elevation above a substrate supporting surface of the temperature adjustment plate, and an elevation below a substrate supporting blade of the substrate handler. The rotatable substrate carriage is adapted to transfer a substrate to and from the substrate supporting surfaces of the temperature adjustment plate, and of the substrate handler blade.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.