Patent · US Expired

Integrated circuit device having reduced bow and method for making same

US6577018B1 · kind B1 · utility

1Cited by

7References

33Claims

0Family size

Assignee

Micron Technology, Inc. · US

Inventors

William Tandy · Boise, US
Matt E. Schwab · Boise, US
Cary J. Baerlocher · Meridian, US

Key dates

Filing date	Aug 25, 2000
Grant date	Jun 10, 2003
Priority date	—
Expiry date	Aug 25, 2020

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19041
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of the semiconductor component. The package has a first surface and a second surface, and side surfaces, where the first surface is opposite the second surface. A parting line of the integrated circuit package is offset toward the second surface of the package, where the first surface optionally comprises the bottom surface of the package. The first surface of the package has one or more recessed areas.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.