Apparatus for the backside gas cooling of a wafer in a batch ion implantation system
US6583428B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2000 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | Oct 4, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2001
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention provides apparatus by which a cooling gas is supplied from a stationary source to the back side of batch ion implanter workpieces being implanted in a rotating or spinning batch implanter process disk. The cooling gas provides improved heat transfer from the workpieces to the process disk, which may be advantageously combined with circulation of cooling fluid through passages in the process disk to remove heat therefrom. The invention further includes a rotary feedthrough employed to transfer the cooling gas from a stationary housing to a gas chamber in a rotating shaft which spins the batch implanter process disk. In addition, a seal apparatus is provided which seals the cooling gas applied to the back sides of the workpieces from the vacuum in which the front sides of the workpieces are implanted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.