Platen for retaining polishing material

US6592439B1 · kind B1 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Shijian Li · San Jose, US
• Manoocher Birang · Los Gatos, US
• Ramin Emami · San Jose, US
• Andrew J. Nagengast · Sunnyvale, US
• Douglas Orcutt Brown · San Jose, US
• Shi-Ping Wang · Fremont, US
• Martin Scales · San Jose, US
• John M. White · Hayward, US

Key dates

• Filing date: Nov 10, 2000
• Grant date: Jul 15, 2003
• Expiry date: Nov 10, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/30625
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Generally, a method and apparatus for retaining polishing material is provided. In one embodiment, the apparatus includes a platen having a top surface, a plurality of channels and one or more vacuum ports. The top surface is adapted to support the polishing material. The plurality of channels are formed in a polishing area of the top surface. The vacuum ports are disposed in the platen and at least one port is in communication with at least one of the channels. Upon application of a vacuum to the ports, the channels remove fluids under the polishing material while securing the polishing material to the top surface.