Method for making projected contact structures for engaging bumped semiconductor devices
US6613662B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2001 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Oct 15, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a bumped die and a bumped packaged IC device. The projections are arranged to make electrical contact with the solder balls of a bumped IC device without substantially deforming the solder ball. Accordingly, reflow of solder balls to reform the solder balls is not necessary with the contact pad of the present invention. Such a contact pad may be provided on various testing equipment such as probes and the like and may be used for both temporary and permanent connections. Also disclosed is an improved method of forming the contact pads by etching and deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.