Multi-stage, high frequency, high power signal amplifier
US6614308B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2001 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Oct 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A broadband RF signal amplifier includes a plurality of transistors attached to a surface of a pedestal, each transistor having an input and an output. An RF input path electrically connected to the transistor inputs includes a passive splitter implemented in a multi-layer printed circuit board and configured to split a RF input signal into a plurality of component input signals. A plurality of corresponding input matching networks including one-quarter wavelength transmission lines implemented in the printed circuit board couple respective component input signals to the transistor inputs at an input impedance, the input matching networks further comprising respective input matching capacitors attached to the pedestal. An RF output path electrically connected to the transistor outputs includes a passive combiner implemented in the printed circuit board and configured to combine component output signals received at the transistor outputs into a RF output signal. A plurality of corresponding output matching networks including one-quarter wavelength transmission lines implemented in the printed circuit board couple the respective component output signals at the transistor outputs to a…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.