Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates
US6616516B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2001 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Dec 13, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67046
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An asymmetric double-sided substrate scrubber is provided. The asymmetric double-sided substrate scrubber includes a first roller and a second roller. The first roller is constructed from a first material having a first density and the second roller is constructed from a second material having a second density. The second density is designed to be greater than the first density. The first roller is designed to be applied onto a first side of a substrate with a first force and the second roller is designed to be applied onto a second side of the substrate with a second force. The second force is configured to be substantially equivalent to the first force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.