Patent · US Expired

Direct heatpipe attachment to die using center point loading

US6625022B2 · kind B2 · utility

16Cited by
10References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 21, 2001
Grant dateSep 23, 2003
Priority date—
Expiry dateSep 21, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/3011
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An apparatus, comprising: a plurality of stacked computer components comprising; a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.