Adsorption process for atomic layer deposition
US6630201B2 · kind B2 · utility
240Cited by
18References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2001 |
| Grant date | Oct 7, 2003 |
| Priority date | — |
| Expiry date | Oct 24, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76814
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for conducting an ALD process to deposit layers on a substrate which includes an electrostatic chuck (ESC) to retain the substrate. Electrode(s) in the chuck assembly are used to induce a voltage on the substrate to promote precursor adsorption on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.