Parallel plate development
US6634805B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2001 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | Oct 10, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/3021
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method is provided for applying a developer to a photoresist material wafer disposed on a semiconductor substrate. The developer system and method employ a developer plate having a plurality of a apertures for dispensing developer. Preferably, the developer plate has a bottom surface with a shape that is similar to the wafer. The developer plate is disposed above the wafer and substantially and/or completely surrounds the top surface of the wafer during application of the developer. A small gap is formed between the wafer and the bottom surface of the developer plate. The wafer and the developer plate form a parallel plate pair, such that the gap can be made small enough so that the developer fluid quickly fills the gap. The developer plate is disposed in very close proximity with respect to the wafer, such that the developer is squeezed between the two plates thereby spreading evenly the developer over the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.