Thermal process apparatus for a semiconductor substrate
US6641302B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2001 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Nov 14, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/0853
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal process apparatus for a semiconductor substrate, including a heating source heating the semiconductor substrate by irradiating a light on one side of the semiconductor substrate, a reflection plate facing to the semiconductor substrate in a state where a reflection cavity is formed with another side of the semiconductor substrate, a thermometer having a light-receiving part provided on the refection plate so as to measure a temperature of the semiconductor substrate by catching a radiation beam from the semiconductor substrate heated by the heating source by the light-receiving part; and light absorption means provided around the light-receiving part for absorbing a diffuse reflection light generated in the reflection cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.