Lien-Chen Chiang
6Patents
3h-index
11Co-inventors
50Inventor score
Filing activity: Sep 25, 2000 → Dec 29, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6476469B2 | Quad flat non-leaded package structure for housing CMOS sensor | Electricity | 237 | Expired |
| US6696749B1 | Package structure having tapering support bars and leads | Electricity | 18 | Expired |
| US7180161B2 | Lead frame for improving molding reliability and semiconductor package with the lead frame | Electricity | 6 | Expired |
| US7459770B2 | Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure | Electricity | 1 | Active |
| US6642735B2 | Semiconductor package for chip with testing contact pad connected to outside | Electricity | 1 | Expired |
| US9355989B2 | Wire bonding device and method of eliminating defective bonding wire | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.