Polishing pad having a grooved pattern for use in chemical mechanical polishing
US6645061B1 · kind B1 · utility
49Cited by
18References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 1999 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Nov 16, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.