Wafer stage for wafer processing apparatus and wafer processing method
US6646233B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2002 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Mar 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer stage for use in wafer processing apparatus which comprises a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate that is attached onto the liquid cooling jacket and has therein a heater and an electrode for electrostatic chuck use, the wafer stage performing wafer processing while letting a wafer be mounted on the ceramic plate, wherein the liquid cooling jacket permits attachment of the ceramic plate through a coolant gas circulating gap as formed over the liquid cooling jacket while disposing between the liquid cooling jacket and the ceramic plate more than one heat resistant seal material containing therein an elastic body for sealing the coolant gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.