Plating bath and method for depositing a metal layer on a substrate
US6652731B2 · kind B2 · utility
14Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2001 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Jan 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/242
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.