Method of fabricating a coated process chamber component
US6656535B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2001 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Dec 21, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/564
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of fabricating a process chamber component that has a ceramic form with grains and grain boundary regions. In the method, the component is bead blasted to provide a surface having a relatively low roughness average of less than about 150 microinches. The component is dipped into a solution having a concentration that is sufficiently low to reduce etching of grain boundary regions of the ceramic form. A metal coating is formed over at least a portion of the ceramic form. The component fabricated by this method can tolerate thicker deposits of sputtered material in a sputtering process without the sputtered deposit accumulates causing spalling of the coating of the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.