Kian Lee
14Patents
9h-index
20Co-inventors
64Inventor score
Filing activity: May 8, 2001 → Nov 29, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6720666B2 | BOC BGA package for die with I-shaped bond pad layout | Electricity | 81 | Expired |
| US6583502B2 | Apparatus for package reduction in stacked chip and board assemblies | Electricity | 76 | Expired |
| US6692987B2 | BOC BGA package for die with I-shaped bond pad layout | Electricity | 57 | Expired |
| US6787917B2 | Apparatus for package reduction in stacked chip and board assemblies | Electricity | 28 | Expired |
| US6656769B2 | Method and apparatus for distributing mold material in a mold for packaging microelectronic devices | Electricity | 19 | Expired |
| US6787923B2 | Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks | Electricity | 16 | Expired |
| US7915718B2 | Apparatus for flip-chip packaging providing testing capability | Electricity | 15 | Expired |
| US7005316B2 | Method for package reduction in stacked chip and board assemblies | Electricity | 10 | Expired |
| US7320933B2 | Double bumping of flexible substrate for first and second level interconnects | Electricity | 9 | Expired |
| US7061124B2 | Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks | Electricity | 7 | Expired |
| US7368391B2 | Methods for designing carrier substrates with raised terminals | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7018871B2 | Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods | Electricity | 4 | Expired |
| US7112048B2 | BOC BGA package for die with I-shaped bond pad layout | Electricity | 2 | Expired |
| US8084846B2 | Balanced semiconductor device packages including lead frame with floating leads and associated methods | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.