Method for heating and cooling substrates
US6658763B2 · kind B2 · utility
14Cited by
23References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2002 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Nov 12, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67748
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for heating and cooling a substrate are provided. A chamber is provided that comprises a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism, a cooling mechanism spaced from the heating mechanism and adapted to cool a substrate positioned proximate the cooling mechanism, and a transfer mechanism adapted to transfer a substrate between the position proximate the heating mechanism and the position proximate the cooling mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.